All Categories on DPACI

Turn-Key Custom Assembly, Packaging and Qualification Component Testing and
Screening Destructive Physical
Analysis and Failure
Analysis QML Memory 5962-
Products DPACI Memory Offering RF Testing, Screening and
Qualification Counterfeit Analysis
Services EEE Parts Management Patented DPEM Process
for Die Removal Wafer/Die Certified Source

DPA Components Intl.
2251 Ward Avenue,
Simi Valley, CA 93065
Phone: 805.581.9200
Fax: 805.581.9790
info@dpaci.com


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		Turn-Key Custom Assembly, Packaging and Qualification Specializing in providing Turn-Key Solutions, we offer comprehensive manufacturing, assembly, qualification, testing, and certification of high reliability EEE components. We have a dedicated, self-contained Class 10,000 clean room to perform all assembly operations from wafer processing to final hermetic package seal. Packaging and assembly of custom microcircuits and hybrids conforming to Class "B", “H” and Class "S", “K” requirements of MIL-PRF-38535, MIL-PRF-38534 and MIL-STD-883 is the initial phase of a Turn-Key Solution effort. Screening, qualification, and testing/analysis ensures that the product to meets mission critical requirements of customer applications. Experienced quality control personnel in our ...




		Component Testing and Screening DPACI performs 100% screening as well as qualification testing on electronic parts supplied to the high reliability commercial, industrial, space, and U.S. military sectors. We generate software and hardware to test microcircuits, discrete semiconductors, hybrids, PEMS, and other EEE electronic components to exact customer and military specifications. Our engineering experience in electronic parts screening, qualification, and in-house test fixture fabrication allows us to provide value added components in a timely manner. Additionally, we also offer ‘Turn-Key’ solutions to qualification and quality conformance inspection (QCI) to qualify and retain qualification of a new product under MIL-PRF-38535 & MIL-PRF-19500 ...




		Destructive Physical Analysis and Failure Analysis DPACI's component analysis laboratory performs major analytical functions, such as destructive physical analysis, failure analysis, counterfeit analysis, and material analysis on components & devices. Our destructive physical analysis techniques are performed in accordance with standards and methods used in most military and space program requirements. Solutions for difficult production problems are resolved through our failure analysis procedures. We perform complete disassembly, testing, and inspection of all types of EEE components in conformance with exact customer design or process requirements. Standards mostly used in our DPA process are: MIL-STD-1580, SSQ25000, MIL-STD-883.




		QML Memory 5962- Products In recent years, DPACI has witnessed an emerging increase in both the requirements and demand for high reliability standard microcircuit drawing (SMD) memory products in the Military and Space Market. Both MIL-STD-3018 (Parts Management) & NASA’s EEE-INST-002 (PEMs specification) now set orders of precedence for DSCC SMD parts when available over SCD and COTS. DPA Components, International has answered the call by offering our own line of QML military memory SRAM products!




		RF Testing, Screening and Qualification DPACI has extensive experience in providing RF testing, screening, as well as QCI services to a diverse range of customers, such as Lockheed Martin, General Dynamics, and Ball Aerospace. We have a fully equipped RF and microwave lab with test capabilities ranging from 40 GHz to 300 GHz for providing RF packaging. Maintained in a Class Zero ESD environment, this lab is stocked with phase noise meters, network analyzers, noise figure meters, RF synthesized sweepers, and other bench and instrumentation test equipment hardware/software.




		Counterfeit Analysis Services We perform counterfeit part analysis on all types of electrical, electronic, and electromechanical (EEE) components. Our suspect counterfeit analysis task groups include source identification, manufacturer validation, external visual inspection, mechanical inspection, electrical test, X-Ray, in-depth internal visual and materials analysis. With one of the largest databases of test reports for EEE components, we can offer similar historical data for correlation with images, test data, certifications and reports.




		EEE Parts Management DPACI provides comprehensive electrical, electronic, and electro-mechanical parts management services to meet the high-reliability program requirements of the industrial, military, and aerospace industry. We work with the Customer Parts Lists, Bill of Materials (BOM), Parts Management plans, and/or as directed by the Customer Statement of Work in order to create a Turn-Key Solution to MIL-STD-3018 ”Parts Management” requirements. In case of obsolescence and DMSMS (Diminishing Manufacturing Sources and Material Shortages) problems, we can offer effective solutions utilizing all of our in-house capabilities to minimize supply chain and logistics problems.




		Patented DPEM Process for Die Removal DPEM (Decapsulate Plastic Encapsulated Module) is DPACI’s patented Turn-Key Solution to replacement of obsolete high reliability devices in legacy systems. From dissolving the plastic encapsulation of a semiconductor device to re-bonding new wires onto a chip or package lead frame, complete solutions are offered. DPACI retains reliability test data as well as customer testimonials for the process and can share this information on a need-to-know basis.




		Wafer/Die Certified Source Because of DPACI’s unique position of being both a customer of and a supplier of services to several major memory manufacturers; we are a source to provide a Turn-Key Solution to your high density memory requirements.