Destructive Physical Analysis and Failure Analysis-Simi Valley-California-DPACI DPACI - Destructive Physical Analysis and Failure Analysis
Turn-Key Custom Assembly, Packaging and QualificationComponent Testing and
ScreeningDestructive Physical
Analysis and Failure
AnalysisQML Memory 5962-
ProductsDPACI Memory OfferingRF Testing, Screening and
QualificationCounterfeit Analysis
ServicesEEE Parts ManagementPatented DPEM Process
for Die RemovalWafer/Die Certified Source
DPA Components Intl.
2251 Ward Avenue,
Simi Valley, CA 93065
Phone: 805.581.9200
Fax: 805.581.9790
info@dpaci.com
 
Search
      GO   
 All Categories    Destructive Physical Analysis and Failure Analysis
All Categories > Counterfeit Analysis Services > Turn-Key Custom Assembly, Packaging and Qualification > Destructive Physical Analysis and Failure Analysis 
    Download PDF Download PDF     Printable Page     Email Email This Page     Save To Favorites Save To Favorites
Request Information

Destructive Physical Analysis and Failure Analysis


    Download PDF Download PDF  
    Email Email This Page  
    Save To Favorites Save To Favorites
  

Analysis02

larger image
DPACI's component analysis laboratory performs major analytical functions, such as destructive physical analysis, failure analysis, counterfeit analysis, and material analysis on components & devices. Our destructive physical analysis techniques are performed in accordance with standards and methods used in most military and space program requirements. Solutions for difficult production problems are resolved through our failure analysis procedures. We perform complete disassembly, testing, and inspection of all types of EEE components in conformance with exact customer design or process requirements. Standards mostly used in our DPA process are: MIL-STD-1580, SSQ25000, MIL-STD-883.

From removal of encapsulants to internal visual inspections after cross section, different types of operations are performed as a part of our Destructive Physical Analysis (DPA) process. Our standard DPA program includes taking external photos, leak test, electrical tests, delidding, internal photos, bond pull testing, SEM, X-Ray, EDXA, XRF, cross section visual examination, and a series of mechanical as well as environmental tests as applicable. This rigorous process of sample testing establishes a baseline specification and ensures that a high reliability component or device is fabricated to the required standards.

Scanning Electronic Microscope (SEM), X-ray fluorescence (XRF), energy dispersive X-ray spectrometry (EDX), and C-mode Scanning Acoustic Microscopy (CSAM) are used to perform in-depth failure and materials analysis on hermetic and plastic devices. We can perform material analysis on any type of material, including continuous fiber reinforced composites, ceramics, and polymers. In addition to in-house support from the electrical test floor in validation of device functionality, we routinely provide electrical data for a device under failure analysis to the customer prior to opening or decapsulation.

We thoroughly analyze failure modes, determine the root cause, and provide complete reports with evidence and conclusion through our failure analysis processes supported by the comprehensive capabilities of the facility. This analysis ensures early identification of potential component failure, equipment defects, and non-conforming material problems to prevent costly assembly, rework, or field failures. Our failure analysis capabilities are extensive and provide critical support to our in-house manufacturing services as well.



Specifications · Additional Information

Specifications

Destructive Physical Analysis

Cross-Section
Decap/Remove Encapsulant
Internal Visual Inspection with Digital Capture
SEM

Visual Inspection

Dimensional Analysis
Marking Consistent with Original Manufacturer Marking (Component and Packaging)
Physical Appearance (Oxidation, Solder Lumps, Missing Pins/Balls, Chips/Cracks, Sanding, Other Irregularities)

Marking/Blacktopping Tests

Acetone Test
Resistance to Solvents

X-ray

Film X-Ray
Real Time X-Ray with Digital Image Capture

Acoustic Microscopy

CSAM

Electrical Test

Test Capability for All EEE Components

Materials Analysis

Energy Dispersive X-Ray Spectrometry (EDX)
X-Ray Fluorescence (XRF)

ESD Sensitivity

Class 0 Test Area

Suspect Counterfeit Analysis Tasks

Acoustic Microscopy
Destructive Physical Analysis
Electrical Test
ESD Sensitivity
Marking/ Blacktopping Tests
Materials Analysis
Visual Inspection
X-Ray

Additional Information

Industries Served

  • Military
  • Space
  • Aerospace
  • Electrical and Electronics

Quality Policy

  • Providing quality components, testing, and analytical services at a fair price.
  • Meeting and striving to improve upon customer due dates for shipments.
  • Meeting and/or exceeding customer service expectations in a responsive, timely manner.
  • Providing Total Solutions to our customers' requirements by offering more capabilities and alternatives in-house.
  • Involving all employees in personnel development programs to continually improve all processes by which our business is conducted.

Quality Clauses

  • AS-1 GROUP = AS9100 Requirement on all Purchase Orders
  • AS-2 GROUP = Clauses for Purchasing Deliverables or Outside Services on Deliverables
  • Individual Quality Provisions / Clauses for Purchasing Deliverables or Outside Services on Deliverables

Certifications

 MORE IMAGES 

· BGA Cross-Section

· External Visual

· Internal Visual

· SEM

· CSAM

· X-Ray

 DOWNLOADS 

width= Destructive Physical & Failure Analysis
(PDF, 189KB)

width= Quality Clauses
(PDF, 18KB)

Request Information
Site Created by ThomasNet Web Solutions and Powered by Navigator Platform
DPA Components Intl. | Greater Value, Turn-Key Solutions