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All Categories > Patented DPEM Process for Die Removal > Decapsulate Plastic Encapsulated Module Process (DPEM)  
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Decapsulate Plastic Encapsulated Module Process (DPEM)



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DPEM (Decapsulate Plastic Encapsulated Module) is DPACI’s patented Turn-Key Solution to replacement of obsolete high reliability devices in legacy systems. From dissolving the plastic encapsulation of a semiconductor device to re-bonding new wires onto a chip or package lead frame, complete solutions are offered. DPACI retains reliability test data as well as customer testimonials for the process and can share this information on a need-to-know basis.

This cost-effective proprietary solution allows us to provide obsolete or hard-to-find ICs that are no longer manufactured in the required pin-outs or hermetic packages. Our patented DPEM process also allows us to remove a die from an existing plastic part and repackage it into a ceramic, metal, or hybrid package. As part of our DPEM process, we also screen the complete components to MIL-STD-883 Class B or Class S procedures.

DPEM parts can satisfy form, fit, function, quality, and reliability requirements for replacement of military or aerospace components. These replacement parts can save millions of dollars over reinvention and manufacturing a military grade device for boards or assemblies. In addition, the delivery is virtually immediate if the plastic COTS part is readily available. We can provide engineering units within days as candidates for your evaluation. DPACI’s DPEM process always include electrical test with read and recorded data to validate authenticity of the dice.

DPACI can also remove dice from some ceramic packages in a similar process called DCEM. These dies can also be used for hybrids or MCM needs.

The DPEM process is also useful for IC failure analysis. We selectively etch and remove the top of a plastic IC leaving all bond wires intact, exposing the die for failure analysis.




Specifications · Additional Information

Specifications

DPEM Processes

Pre-Cap Visual Inspection
Dissolving the plastic encapsulation of a semiconductor device
Removing the die or chip
Removing the bond wires from the chip, keeping bond pad integrity
Relocating the chip into a high reliability ceramic or metal package
Attaching the die to the package substrate
Rebonding new wires onto the chip and to the package lead frame
Resealing the package maintaining package hermeticity
Performing 100% testing and QCI to ensure reliability for aerospace and military applications

Standards Met

MIL-STD-883 Class B
MIL-STD-883 Class S
883/5004 QCI
883/5005 QCI


Additional Information

Industries Served

  • Military
  • Space
  • Aerospace
  • Electrical and Electronics

Quality Policy

  • Providing quality components, testing, and analytical services at a fair price.
  • Meeting and striving to improve upon customer due dates for shipments.
  • Meeting and/or exceeding customer service expectations in a responsive, timely manner.
  • Providing Total Solutions to our customers' requirements by offering more capabilities and alternatives in-house.
  • Involving all employees in personnel development programs to continually improve all processes by which our business is conducted.

Quality Clauses

  • AS-1 GROUP = AS9100 Requirement on all Purchase Orders
  • AS-2 GROUP = Clauses for Purchasing Deliverables or Outside Services on Deliverables
  • Individual Quality Provisions / Clauses for Purchasing Deliverables or Outside Services on Deliverables

Certifications



 MORE IMAGES 

· Die #1

· Die Closeup #1

· External View #1

· X-ray View #1

· Die #2

· Die Closeup #2

· External View #2

· X-ray View #2

· Die #3

· Die Closeup #3

· External View #3

· X-ray View #3

· Die #4

· Die Closeup #4

· External View #4

· X-ray View #4


 DOWNLOADS 

 width= DPEM & Legacy Parts
(PDF, 360KB)

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(PDF, 18KB)


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