Wafer/Die Certified Source-Simi Valley-California-DPACI
DPACI - Semiconductor Die / Wafer Source
805.581.9200
info@dpaci.com
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DPA Components Intl.
2251 Ward Avenue,
Simi Valley, CA 93065
Phone: 805.581.9200
Fax: 805.581.9790
info@dpaci.com
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Because of DPACI’s unique position of being both a customer of and a supplier of services to several major memory manufacturers; we are a source to provide a Turn-Key Solution to your high density memory requirements.
To offer a complete Turn-Key Solution requires the ability to source both leading edge high density and older die / wafer products. DPACI has factory direct access to Static Ram, Flash and DRAM Die / Wafer. For specific products please reference the dpaci.com web site or search Cypress.com or Samsungsemi.com for your needs. For obsolete parts, DPACI can assist you with sourcing or recommend an upgrade. DPACI has access to roadmaps, data sheets and die maps to assist you with your choices.
One more advantage of using DPACI for your wafer / die source is the ability to obtain die or elemental evaluation certification in accordance with MIL-PRF-38534 directly with one order. Elemental Evaluation in accordance with Table C-II of M38534 is performed to certify the wafer lot to be Class H or Class K compliance in accordance with MIL-PRF-38534 for the use in hybrids and multichip modules. Our standard die evaluation for H and K certification is as follows:
Sample selection per method 2018 of MIL-STD-883.
Package and prepare die in accordance with C.3.3.3.2 of MIL-PRF-38534.
Perform die evaluation per MIL-PRF-38534 paragraph C.3.3.6.6, Table C-II for Class H or Class K as applicable.
Test report with read and record data of die evaluation.
Certification of wafer traceability lot to Class H or Class K requirements.
We perform all die preparation, sample assembly, evaluation and test per Table C-II in-house with full traceability and MIL-STD-883 DSCC Laboratory Certification. Allow DPACI to provide a Turn-Key Solution to your custom hybrid or MCM needs.
Specifications
·
Additional Information
Specifications
Capabilities
Die Evaluation
Die Preparation
Elemental Evaluation
Sample Assembly
Turn-Key Solution for High Density Memory Requirements
Standards Met
MIL-STD-883
MIL-PRF-38534
Applications
Hybrids
Multichip Modules
Additional Information
Industries Served
Military
Space
Aerospace
Electrical and Electronics
Quality Policy
Providing quality components, testing, and analytical services at a fair price.
Meeting and striving to improve upon customer due dates for shipments.
Meeting and/or exceeding customer service expectations in a responsive, timely manner.
Providing Total Solutions to our customers' requirements by offering more capabilities and alternatives in-house.
Involving all employees in personnel development programs to continually improve all processes by which our business is conducted.
Quality Clauses
AS-1 GROUP = AS9100 Requirement on all Purchase Orders
AS-2 GROUP = Clauses for Purchasing Deliverables or Outside Services on Deliverables
Individual Quality Provisions / Clauses for Purchasing Deliverables or Outside Services on Deliverables
Certifications
DSCC QML MIL-PRF-38535 Q & V Certification
DSCC QML MIL-PRF-19500 Certification In Process
DSCC Validated for MIL-STD-883 Screening & Qualification Testing
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Wafer or Die Certified Source
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Quality Clauses
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