Counterfeit Analysis Services-Simi Valley-California-DPACI DPACI - Counterfeit Analysis Services
Turn-Key Custom Assembly, Packaging and QualificationComponent Testing and
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ServicesEEE Parts ManagementPatented DPEM Process
for Die RemovalWafer/Die Certified Source
DPA Components Intl.
2251 Ward Avenue,
Simi Valley, CA 93065
Phone: 805.581.9200
Fax: 805.581.9790
info@dpaci.com
 
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Counterfeit Analysis Services


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X-Ray Counterfit

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We perform counterfeit part analysis on all types of electrical, electronic, and electromechanical (EEE) components. Our suspect counterfeit analysis task groups include source identification, manufacturer validation, external visual inspection, mechanical inspection, electrical test, X-Ray, in-depth internal visual and materials analysis. With one of the largest databases of test reports for EEE components, we can offer similar historical data for correlation with images, test data, certifications and reports.

DPACI’s methodology can detect counterfeits before they show up as a widespread epidemic in your production lines or component failures. Our counterfeit analysis techniques go beyond the standard surface and internal structure validation. We can provide complete functional verification of the device and obtain read and recorded data to certify the authenticity of the product. Surface inspection can only detect fraudulent markings, solder lumps, chips/cracks, and other surface irregularities that rise due to oxidation or sanding are detected through visual inspection. We use real time X-Ray to detect anomalies in 3-D with time stamped recorded video. In depth visual inspection such as SEM (Scanning Electron Microscope) CSAM (Scanning Acoustic Microscope), cross sectioning, in-depth material analysis using EDX and XRF (Energy dispersive X-ray spectrometry) can detect material anomalies in counterfeits. However, electrical and functional tests using DPACI’s large device testing library in addition to all other inspection methodologies is a Turn-Key Solution to counterfeit suspects.



Specifications · Additional Information

Specifications

Suspect Counterfeit Analysis Tasks

Acoustic Microscopy
Destructive Physical Analysis
Electrical Test
ESD Sensitivity
Marking/ Blacktopping Tests
Materials Analysis
Visual Inspection
X-Ray

Visual Inspection

Dimensional Analysis
Marking Consistent with Original Manufacturer Marking (Component and Packaging)
Physical Appearance (Oxidation, Solder Lumps, Missing Pins/Balls, Chips/Cracks, Sanding, Other Irregularities)

Marking/Blacktopping Tests

Acetone Test
Resistance to Solvents

X-ray

Film X-Ray
Real Time X-Ray with Digital Image Capture

Acoustic Microscopy

CSAM

Electrical Test

Test Capability for All EEE Components

Materials Analysis

Energy Dispersive X-Ray Spectrometry (EDX)
X-Ray Fluorescence (XRF)

Destructive Physical Analysis

Cross-Section
Decap/Remove Encapsulant
Internal Visual Inspection with Digital Capture
SEM

ESD Sensitivity

Class 0 Test Area

Additional Information

Industries Served

  • Military
  • Space
  • Aerospace
  • Electrical and Electronics

Quality Policy

  • Providing quality components, testing, and analytical services at a fair price.
  • Meeting and striving to improve upon customer due dates for shipments.
  • Meeting and/or exceeding customer service expectations in a responsive, timely manner.
  • Providing Total Solutions to our customers' requirements by offering more capabilities and alternatives in-house.
  • Involving all employees in personnel development programs to continually improve all processes by which our business is conducted.

Quality Clauses

  • AS-1 GROUP = AS9100 Requirement on all Purchase Orders
  • AS-2 GROUP = Clauses for Purchasing Deliverables or Outside Services on Deliverables
  • Individual Quality Provisions / Clauses for Purchasing Deliverables or Outside Services on Deliverables

Certifications

 MORE IMAGES 

· AIT Counterfit

· PAXIT #1

· PAXIT #2

· Q-Bam Scan SN46

· Surface Scan 30 MHz

· X-Ray Counterfit

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